The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Mar. 02, 2018
Toshiba Memory Corporation, Minato-ku, Tokyo, JP;
Manabu Matsumoto, Yokohama Kanagawa, JP;
Katsuya Murakami, Sumida Tokyo, JP;
Akira Tanimoto, Yokohama Kanagawa, JP;
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Abstract
A semiconductor package includes a board, a plurality of semiconductor memory chips, a controller chip, and a sealing resin portion. The plurality of semiconductor memory chips are stacked in a thickness direction of the board. The controller chip is disposed between the board and the plurality of semiconductor memory chips or on a side of the plurality of semiconductor chips opposite to the board. The sealing resin portion seals the plurality of semiconductor memory chips and the controller chip. The plurality of semiconductor memory chips include at least one through via that penetrates one or more semiconductor memory chips of the plurality of semiconductor memory chips in the thickness direction of the board to be connected to the controller chip.