The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Jun. 05, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Hendrik Pieter Jacobus de Bock, Clifton Park, NY (US);

Joseph Lucian Smolenski, Slingerlands, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H01L 23/46 (2006.01); H01L 23/556 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); H01L 23/38 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01L 23/556 (2013.01); G06F 1/20 (2013.01); H01L 23/4006 (2013.01); H01L 23/473 (2013.01); H01L 23/38 (2013.01); H01L 23/427 (2013.01);
Abstract

A power electronics system is provided. The system includes at least one outer wall defining an outer zone including a plurality of first electronic components having a first normal operating maximum temperature and capable of generating electromagnetic fields. The system further includes at least one inner wall defining an inner zone disposed within the outer zone and including a plurality of second electronic components having a second normal operating maximum temperature, the first normal operating maximum temperature higher than the second normal operating maximum temperature, the inner zone substantially electromagnetically sealed against electromagnetic interference generated by the plurality of first electronic components. The system further includes a heat transfer assembly coupled to the at least one inner wall and configured to facilitate operating the plurality of second electronic components below the second normal operating maximum temperature by transferring heat from the inner zone to the outer zone.


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