The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Dec. 19, 2017
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;
Young-Bae Kim, Seoul, KR;
Sang-Hoon Ahn, Goyang-si, KR;
Eui-Bok Lee, Seoul, KR;
Su-Hyun Bark, Suwon-si, KR;
Hyeok-Sang Oh, Suwon-si, KR;
Woo-Jin Lee, Hwaseong-si, KR;
Hoon-Seok Seo, Suwon-si, KR;
Sung-Jin Kang, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
An integrated circuit (IC) device includes a lower wiring structure including a lower metal film. The lower wiring structure penetrates at least a portion of a first insulating film disposed over a substrate. The IC device further includes a capping layer covering a top surface of the lower metal film, a second insulating film covering the capping layer, an upper wiring structure penetrating the second insulating film and the capping layer, and electrically connected to the lower metal film, and an air gap disposed between the lower metal film and the second insulating film. The air gap has a width defined by a distance between the capping layer and the upper wiring structure.