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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10276433 B1

PDFFull Text
Date of Patent:
Apr. 30, 2019

Filed:

Nov. 22, 2017

Method for fabricating planarization layer

Applicant:

Chunghwa Picture Tubes, Ltd., Taoyuan, TW;

Inventors:

Wei-Hsin Lee, Taoyuan, TW;

Chin-Tzu Kao, Changhua County, TW;

Assignee:

Chunghwa Picture Tubes, LTD., Taoyuan, TW;

Attorney:

JCIPRNET

Primary Examiner:

Mamadou L Diallo

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/027 (2006.01); G03F 7/038 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); G03F 7/039 (2006.01); H01L 29/786 (2006.01); H01L 51/05 (2006.01); G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7688 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2002 (2013.01); G03F 7/26 (2013.01); H01L 21/0272 (2013.01); H01L 21/0273 (2013.01); G06F 3/044 (2013.01); G06F 2203/04103 (2013.01); H01L 29/7869 (2013.01); H01L 29/78654 (2013.01); H01L 29/78669 (2013.01); H01L 29/78678 (2013.01); H01L 51/0566 (2013.01);
Abstract

A method for fabricating a planarization layer includes: forming an active device on a substrate; covering the active device with a passivation layer; forming a pad layer on the passivation layer; forming an overcoating layer covering the passivation layer and the pad layer on the substrate; and removing a portion of the overcoating layer and the pad layer by an exposure and development process to form a patterned overcoating layer, wherein the patterned overcoating layer has an opening exposing the passivation layer on a position relative to the active device. The method for fabricating the planarization layer of the disclosure may save exposure to enhance productivity.

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