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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10276373 B1

PDFFull Text
Date of Patent:
Apr. 30, 2019

Filed:

Apr. 19, 2017

Method of manufacturing a semiconductor device

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yong Chul Jeong, Suwon-si, KR;

Tae Kyu Lee, Pyeongtaek-si, KR;

Sung Sik Park, Hwaseong-si, KR;

Joon Soo Park, Seongnam-si, KR;

Kwang Sub Yoon, Yongin-si, KR;

Boo Hyun Ham, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Mohammed R Alam

Int. Cl.
CPC ...
H01L 21/027 (2006.01); G03F 7/09 (2006.01); G03F 7/075 (2006.01); G03F 7/42 (2006.01); H01L 21/311 (2006.01); H01L 21/266 (2006.01); H01L 21/768 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0276 (2013.01); G03F 7/0752 (2013.01); G03F 7/091 (2013.01); G03F 7/094 (2013.01); G03F 7/427 (2013.01); H01L 21/266 (2013.01); H01L 21/31144 (2013.01); H01L 21/76805 (2013.01); H01L 21/76895 (2013.01); H01L 21/823431 (2013.01);
Abstract

A method for manufacturing a semiconductor device includes forming an etch target layer on a semiconductor substrate, forming a first photoresist pattern disposed on the etch target layer, irradiating ultraviolet (UV) light in an oxygen-containing atmosphere to remove the first photoresist pattern from the etch target layer, and forming a second photoresist pattern on the etch target layer.

Find Patent Forward Citations

Jeong, Yong. (2019). Method of manufacturing a semiconductor device (U.S. Patent No. 10276373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10276373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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