The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Mar. 24, 2016
Applicant:

Fdk Corporation, Minato-ku, Tokyo, JP;

Inventors:

Yohei Fujii, Tokyo, JP;

Makoto Okamoto, Tokyo, JP;

Masayoshi Kimura, Tokyo, JP;

Toshimasa Sugihara, Tokyo, JP;

Assignee:

FDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/30 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/306 (2013.01); H01F 2027/2809 (2013.01);
Abstract

An electronic module is provided with a circuit board including a central-axis insertion hole and composed by laminating a multitude of wiring layers; and a core formed of a magnetic material and inserted through the central-axis insertion hole, wherein the circuit board includes a plurality of coil wiring patterns formed in positions of the respective wiring layers surrounding the core insertion hole; and edge-face through-holes formed on inner wall surfaces of the central-axis core insertion hole to electrically connect the plurality of coil wiring patterns to form a coil, the central-axis insertion hole has a octagon shape in plan view, concave portions are disposed on the inner wall surfaces corresponding to sides of the octagon shape, and the edge-face through-holes are formed in the concave portions.


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