The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Jul. 23, 2015
Applicant:

Valeo Equipements Electriques Moteur, Creteil, FR;

Inventor:

Nicolas Marier, Fresnes sur Marne, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 7/521 (2006.01); G01S 15/08 (2006.01); G01S 15/93 (2006.01); H05K 1/18 (2006.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 1/09 (2006.01); G10K 11/00 (2006.01);
U.S. Cl.
CPC ...
G01S 7/521 (2013.01); G01S 15/08 (2013.01); G01S 15/931 (2013.01); G10K 11/004 (2013.01); H05K 1/09 (2013.01); H05K 1/185 (2013.01); H05K 1/188 (2013.01); H05K 3/0032 (2013.01); H05K 3/0047 (2013.01); H05K 3/22 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); G01S 2015/932 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

The invention relates to an ultrasonic transducer () of the type comprising a housing () provided with an electrical connector (), at least one ultrasonic transducer () and an electronic card () for controlling the transducer and which is arranged inside the housing and consists of a printed circuit board () on which active components () and passive components () are mounted. According to the invention, the active components include integrated active components () which are completely embedded in a substrate of the printed circuit board and the passive components include integrated passive components () which are completely embedded in the substrate. According to another feature, the active components and the passive components include surface-mounted components () arranged solely on one side of the printed circuit board and the transducer is mounted on an opposite side.


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