The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Mar. 30, 2017
Applicant:
Nagano Keiki Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
NAGANO KEIKI CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); G01L 19/14 (2006.01); G01L 19/00 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0048 (2013.01); G01L 19/0038 (2013.01); G01L 19/145 (2013.01);
Abstract
A sensor module and a joint are made of different metal materials. The sensor module includes a first portion located near a diaphragm and a second portion having a large-diameter portion whose diameter is larger than that of the first portion. A step engaged with a peripheral edge of the large-diameter portion is formed on the joint. The large-diameter portion and the joint are mutually bonded through a bonding portion. The bonding portion is bonded by a plastic deformation bonding that is so-called metal flow. A space is defined between the joint and the module body.