The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Jan. 29, 2014
Applicants:

Willi Henkenjohann, Wuppertal, DE;

Karl Kuhmann, Duelmen, DE;

Maximilian Gruhn, Marl, DE;

Andreas Pawlik, Recklinghausen, DE;

Martin Risthaus, Olfen, DE;

Klaus Welsch, Breckerfeld, DE;

Sven Mang, Hagen, DE;

Inventors:

Willi Henkenjohann, Wuppertal, DE;

Karl Kuhmann, Duelmen, DE;

Maximilian Gruhn, Marl, DE;

Andreas Pawlik, Recklinghausen, DE;

Martin Risthaus, Olfen, DE;

Klaus Welsch, Breckerfeld, DE;

Sven Mang, Hagen, DE;

Assignees:

Evonik Degussa GmbH, Essen, DE;

SI-Coatings GmbH, Wuppertal, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 167/00 (2006.01); B32B 15/092 (2006.01); C09J 177/00 (2006.01); C09J 177/02 (2006.01); C09J 177/06 (2006.01); C09J 175/04 (2006.01); C08G 18/80 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01); B32B 15/08 (2006.01); B32B 7/12 (2006.01); C09J 5/06 (2006.01); C08L 61/06 (2006.01); C08L 63/00 (2006.01); C08L 75/04 (2006.01); C08L 77/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/092 (2013.01); C08G 18/8061 (2013.01); C08G 59/4028 (2013.01); C08G 59/621 (2013.01); C08L 61/06 (2013.01); C08L 63/00 (2013.01); C08L 75/04 (2013.01); C08L 77/00 (2013.01); C09J 5/06 (2013.01); C09J 167/00 (2013.01); C09J 175/04 (2013.01); C09J 177/00 (2013.01); C09J 177/02 (2013.01); C09J 177/06 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2307/712 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/003 (2013.01); C09J 2477/00 (2013.01); C09J 2477/003 (2013.01); Y10T 428/31522 (2015.04); Y10T 428/31529 (2015.04);
Abstract

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.


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