The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Jun. 10, 2015
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

John E. Gozum, Stillwater, MN (US);

DanLi Wang, Shoreview, MN (US);

Dwight B. Schoenherr, Stillwater, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 26/06 (2006.01); B29C 73/02 (2006.01); C04B 26/02 (2006.01); C04B 26/04 (2006.01); C04B 26/28 (2006.01); C09D 133/08 (2006.01); C08K 7/02 (2006.01); E04G 23/02 (2006.01); C04B 103/00 (2006.01); C04B 111/20 (2006.01); C04B 111/72 (2006.01); B29K 33/04 (2006.01); B29K 509/08 (2006.01); C04B 103/44 (2006.01); C08K 7/28 (2006.01); E04F 21/06 (2006.01);
U.S. Cl.
CPC ...
C04B 26/06 (2013.01); B29C 73/02 (2013.01); C04B 26/026 (2013.01); C04B 26/04 (2013.01); C04B 26/28 (2013.01); C08K 7/02 (2013.01); C09D 133/08 (2013.01); E04G 23/0203 (2013.01); B29K 2033/04 (2013.01); B29K 2509/08 (2013.01); C04B 2103/0065 (2013.01); C04B 2103/44 (2013.01); C04B 2111/29 (2013.01); C04B 2111/72 (2013.01); C08K 7/28 (2013.01); E04F 21/06 (2013.01); E04G 23/02 (2013.01); Y02W 30/97 (2015.05);
Abstract

A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.


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