The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Oct. 13, 2014
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Sean Matthew Garner, Elmira, NY (US);
Michael Lesley Sorensen, Waverly, NY (US);
Assignee:
Corning Incorporated, Corning, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C03C 21/00 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01); C03C 3/076 (2006.01); C03C 3/078 (2006.01); C03C 3/083 (2006.01); C03C 3/085 (2006.01); C03C 3/087 (2006.01); C03C 3/089 (2006.01); C03C 3/091 (2006.01); C03C 3/093 (2006.01); C03C 3/095 (2006.01); C03C 4/18 (2006.01);
U.S. Cl.
CPC ...
C03C 21/002 (2013.01); B32B 17/061 (2013.01); B32B 17/064 (2013.01); B32B 17/10137 (2013.01); C03C 3/076 (2013.01); C03C 3/078 (2013.01); C03C 3/083 (2013.01); C03C 3/085 (2013.01); C03C 3/087 (2013.01); C03C 3/089 (2013.01); C03C 3/091 (2013.01); C03C 3/093 (2013.01); C03C 3/095 (2013.01); C03C 4/18 (2013.01);
Abstract
A method of performing ion exchange of a thin, flexible glass substrate having an average thickness equal to or less than about 0.3 mm to chemically strengthen the glass substrate is disclosed. The chemically strengthened glass substrate comprises a first compressive stress layer having a first depth of layer, and a second compressive stress layer having a second depth of layer, the first and second stress layers being separated by a layer of tensile stress. A laminated article comprising the chemically strengthened glass substrate is also described.