The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Jun. 20, 2017
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Yoichi Naganuma, Matsumoto, JP;

Shuichi Tanaka, Chino, JP;

Eiju Hirai, Azumino, JP;

Toshiaki Hamaguchi, Fujimi-machi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1623 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1607 (2013.01); B41J 2/1626 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/1634 (2013.01); B41J 2/1643 (2013.01); B41J 2/1645 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/11 (2013.01); B41J 2202/18 (2013.01);
Abstract

There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.


Find Patent Forward Citations

Loading…