The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

May. 26, 2016
Applicant:

Milliken & Company, Spartanburg, SC (US);

Inventors:

Kirkland W. Vogt, Simpsonville, SC (US);

Pradipkumar Bahukudumbi, Greenville, SC (US);

Assignee:

Milliken & Company, Spartanburg, SC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/02 (2006.01); B32B 5/06 (2006.01); B32B 5/26 (2006.01); B32B 7/08 (2019.01); B29B 11/16 (2006.01); B29B 13/02 (2006.01); B29C 51/00 (2006.01); B29C 70/08 (2006.01); B29C 70/14 (2006.01); B29C 70/54 (2006.01); B29K 23/00 (2006.01); B29K 33/04 (2006.01); B29L 31/30 (2006.01); D06M 17/04 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29B 11/16 (2013.01); B29B 13/023 (2013.01); B29C 51/004 (2013.01); B29C 70/081 (2013.01); B29C 70/14 (2013.01); B29C 70/545 (2013.01); B32B 5/022 (2013.01); B32B 5/06 (2013.01); B32B 5/26 (2013.01); B32B 7/08 (2013.01); D06M 17/04 (2013.01); B29K 2023/12 (2013.01); B29K 2033/04 (2013.01); B29K 2105/0085 (2013.01); B29L 2031/3011 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2305/076 (2013.01); D10B 2321/022 (2013.01); D10B 2321/08 (2013.01);
Abstract

A process for forming a moldable, uncured nonwoven composite containing forming a outermost nonwoven layer, forming a structural nonwoven layer, needling the structural nonwoven layer and the outermost nonwoven layer together from both the outer surface of the outermost nonwoven layer and the second surface of the structural nonwoven layer, applying an uncured, water-based thermosetting resin having a cure temperature of at least about 160° C. to the second surface of the structural nonwoven layer, and at least partially drying the uncured, wet nonwoven composite. Heat and pressure may be applied to form the moldable, uncured composite. A moldable, uncured nonwoven composite and a molded, cured nonwoven composite are also disclosed.


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