The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Apr. 07, 2015
Nissan Motor Co., Ltd., Yokohama-shi, Kanagawa, JP;
Hirotaka Nakayama, Kanagawa, JP;
Taewon Kim, Kanagawa, JP;
Yukinari Goto, Kanagawa, JP;
Toru Sato, Kanagawa, JP;
Takashi Matsuoka, Kanagawa, JP;
Nissan Motor Co., Ltd., Yokohama, JP;
Abstract
Provided is a bonding state inspection method to accurately determine the quality of the bonding state of plate materials that have been ultrasonically bonded. The bonding state inspection method comprises a measuring step in which the rate of energy transfer rate to an anvil is measured each time a vibrating horn is pressed against a plurality of superimposed, plate materials on the anvil and the plate materials are ultrasonically bonded; a calculation step in which a variable threshold is calculated using the energy transfer rate measured each time of the ultrasonic bonding; and a determination step in which the quality of the bonding state of the plate materials is determined based on comparison between the magnitude of the energy transfer rate measured in the measuring step and the variable threshold calculated in the calculation step of the previous ultrasonic bonding.