The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Apr. 24, 2015
Applicant:

Imec, Leuven, BE;

Inventors:

Maria Op De Beeck, Leuven, BE;

Eric Beyne, Leuven, BE;

Philippe Soussan, Marseilles, FR;

Assignee:

IMEC, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); A61B 5/00 (2006.01); A61N 1/375 (2006.01); A61N 1/372 (2006.01); A61M 5/142 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/686 (2013.01); A61M 5/14276 (2013.01); A61N 1/375 (2013.01); A61N 1/37205 (2013.01); H01L 23/3114 (2013.01); A61B 5/6861 (2013.01); A61B 2562/028 (2013.01); A61B 2562/0247 (2013.01); A61M 2205/0244 (2013.01); A61M 2205/8206 (2013.01); A61N 1/3756 (2013.01); H01L 24/48 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01);
Abstract

A method is disclosed for packaging a device, e.g., for bio-medical applications. In one aspect, the method includes obtaining a component on a substrate and separating the component and a first part of the substrate from a second part of the substrate using at least one physical process inducing at least one sloped side wall on the first part of the substrate. The method also includes providing an encapsulation for the chip. The resulting packaged chip advantageously has a good step coverage resulting in a good hermeticity, less sharp edges resulting in a reduced risk of damaging or infection after implantation and has a relatively small packaged volume compared to conventional big box packaging techniques.


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