The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2019

Filed:

Jul. 01, 2015
Applicants:

Young Chul Park, Seoul, KR;

Soo Han Chae, Seoul, KR;

Inventors:

Young Chul Park, Seoul, KR;

Soo Han Chae, Seoul, KR;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A41D 3/00 (2006.01); A41D 5/00 (2006.01); A41D 27/24 (2006.01); A41D 31/00 (2019.01); A41H 41/00 (2006.01); A41H 43/04 (2006.01); B29C 65/00 (2006.01); B29C 65/04 (2006.01); B29C 65/48 (2006.01); B29C 65/52 (2006.01); B29C 65/62 (2006.01); B29C 65/72 (2006.01); B29C 65/82 (2006.01); B29K 27/18 (2006.01); B29K 67/00 (2006.01); B29K 75/00 (2006.01); B29K 77/00 (2006.01); B29L 31/48 (2006.01); B32B 37/00 (2006.01); B32B 37/06 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
A41H 43/04 (2013.01); A41D 3/00 (2013.01); A41D 5/00 (2013.01); A41D 27/245 (2013.01); A41D 31/0038 (2013.01); A41H 41/00 (2013.01); B29C 65/04 (2013.01); B29C 65/4835 (2013.01); B29C 65/526 (2013.01); B29C 65/72 (2013.01); B29C 65/8215 (2013.01); B29C 66/1122 (2013.01); B29C 66/221 (2013.01); B29C 66/43 (2013.01); B29C 66/729 (2013.01); B29C 66/81427 (2013.01); B29C 66/8322 (2013.01); B32B 37/0053 (2013.01); B32B 37/06 (2013.01); B32B 37/1292 (2013.01); B29C 65/4815 (2013.01); B29C 65/62 (2013.01); B29C 66/71 (2013.01); B29C 66/81431 (2013.01); B29C 66/949 (2013.01); B29L 2031/4842 (2013.01); B32B 2305/18 (2013.01); B32B 2307/304 (2013.01); B32B 2437/00 (2013.01);
Abstract

A process of manufacturing a down product comprises at least one bonding pattern line for the compartment separation without forming sewing holes by printing and drying a heat-reactive adhesive on the inner surface of an inner fabric, an optional mesh material and/or an outer fabric in a predetermined pattern, laminating said inner fabric, optional mesh material and/or outer fabric, and then high-frequency heating them under pressing with a pressing pattern the same as the printing pattern to bond the inner fabric, optional mesh material and outer fabric. Accordingly, it is possible to manufacture a down product having a bonding pattern line composed of a bonding line with excellent adhesiveness and durability and an aesthetically excellent pattern line with good clearness and finishing quality as well as to achieve a mass production of down products by mechanization and automation.


Find Patent Forward Citations

Loading…