The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Jul. 26, 2017
Jvc Kenwood Corporation, Yokohama-shi, Kanagawa, JP;
Denso Corporation, Kariya-shi, Aichi-pref, JP;
Takeshi Moribayashi, Yokohama, JP;
Tatsuo Saito, Kariya, JP;
Kazuaki Yanagimura, Kariya, JP;
Hiromi Sekito, Kariya, JP;
JVC KENWOOD CORPORATION, Yokohama-Shi, JP;
DENSO CORPORATION, Kariya-Shi, JP;
Abstract
A heat dissipating structure includes an integrated circuit; a bracket; a heat sink; a housing; a first fastening member that is inserted into a first fastening hole provided to the bracket, and is inserted into a fastening hole provided to the heat sink, and that assembles the integrated circuit to the bracket and the heat sink, while a surface of the integrated circuit contacts with the bracket, and another surface contacts with the heat sink; and a second fastening member that is inserted into a second fastening hole provided to the bracket, and into a fastening hole provided to the housing, and assembles the bracket to the housing. The heat sink includes one surface that contacts with the housing, the one surface being on a side opposite to a surface contact with the integrated circuit, and the one first fastening member is positioned spaced from the housing.