The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Jul. 12, 2017
Apple Inc., Cupertino, CA (US);
David A. Hurrell, San Mateo, CA (US);
Tyler B. Cater, San Jose, CA (US);
Scott P. Porter, Inglewood, CA (US);
Salome Bavetta, Sunnyvale, CA (US);
Anthony P. Grazian, Los Gatos, CA (US);
Benjamin J. Pope, Sunnyvale, CA (US);
Scott A. Myers, Saratoga, CA (US);
Ashutosh Y. Shukla, Playa Vista, CA (US);
Benjamin M. Russo, Santa Clara, CA (US);
Christopher Wilk, Los Gatos, CA (US);
David MacNeil, Cupertino, CA (US);
Eric N. Nyland, Santa Clara, CA (US);
Ihtesham H. Chowdhury, Los Altos, CA (US);
Joseph F. Maldonado, Rohnert Park, CA (US);
Kevin M. Froese, San Francisco, CA (US);
Richard Hung Minh Dinh, Saratoga, CA (US);
Ruchir M. Dave, San Jose, CA (US);
Teemu P. Sipila, Campbell, CA (US);
Yang Liu, Cupertino, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
This disclosure describes a speaker assembly suitable for use in a portable electronic device utilizing water resistant ports. The speaker assembly can have an open back that subjects a back volume of the speaker to pressure differentials within a device housing of the portable electronic device. The speaker assembly can utilize a speaker surround having a varying thickness. The varying thickness speaker surround allows the speaker to maintain an acceptable frequency response profile while limiting the travel of the diaphragm it is coupled with. The disclosure also describes how electrically conductive pathways can be integrated within a housing of the speaker assembly.