The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Jan. 10, 2017
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Neal D. Evans, Sunnyvale, CA (US);

Jesse A. Lippert, San Jose, CA (US);

Nikolas T. Vitt, Sunnyvale, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 1/08 (2006.01); H04R 1/06 (2006.01);
U.S. Cl.
CPC ...
H04R 1/08 (2013.01); H04R 1/06 (2013.01); H04R 1/086 (2013.01); H04R 2201/003 (2013.01); H04R 2499/11 (2013.01);
Abstract

An electronic device comprising having an enclosure with an enclosure wall separating a surrounding environment from an encased space. The enclosure wall includes a top portion having an acoustic channel extending from the encased space to the surrounding environment and a bottom portion. A microphone assembly module positioned within the encased space, and having a microphone acoustically coupled to a sound inlet port that is aligned with the acoustic channel and an air permeable water resistant membrane. A first support member is dimensioned to translatably couple the microphone assembly module to the top portion of the enclosure wall and translate the microphone assembly in response to a pressure change within the acoustic channel, and a second support member is dimensioned to translatably couple the microphone assembly module to the bottom portion of the enclosure wall.


Find Patent Forward Citations

Loading…