The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Jun. 20, 2017
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventors:

Dao-Wei Chen, New Taipei, TW;

Kun-Jung Wu, Hsinchu, TW;

Bo-Yu Ko, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/043 (2006.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 33/22 (2010.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 21/4875 (2013.01); H01L 23/043 (2013.01); H01L 23/3157 (2013.01); H01L 33/22 (2013.01); H01L 33/52 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An LED package structure includes a first metal plate, a second metal plate, and a mold. The first metal plate has at least one first protrusion portion. The second metal plate has at least one second protrusion portion. The mold is disposed on the first metal plate and the second metal plate, in which the mold has a first side surface, a second side surface opposite to the first side surface, a third side surface, and a fourth side surface opposite to the third side surface. The first and second protrusion portion protrude respectively from the first side surface and the second side surface, and the first metal plate and the second metal plate are covered by the third side surface and the fourth side surface, in which a portion of the first side surface between the first edge and the first protrusion portion is a fracture surface.


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