The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Oct. 10, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Woo Jung Park, Hwaseong-si, KR;

JungSung Kim, Seoul, KR;

JungKyu Park, Seoul, KR;

Taeyoung Choi, Seoul, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 33/26 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/50 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 33/504 (2013.01); H01L 33/483 (2013.01); H01L 33/508 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/62 (2013.01); H01L 2224/16245 (2013.01);
Abstract

A light-emitting device (LED) package including a package body including a mounting region at an upper portion thereof; a lead frame below the package body; a semiconductor light-emitting device in the mounting region and electrically connected to the lead frame; a top layer attached to a top surface of the semiconductor light-emitting device, the top layer including a red phosphor; and a molding layer in the mounting region, the molding layer covering the top layer and including a short-wavelength phosphor having a peak emission wavelength that is shorter than a peak emission wavelength of the red phosphor, wherein the top layer exposes a side surface of the semiconductor light-emitting device, and the molding layer is in contact with the side surface of the semiconductor light-emitting device.


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