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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10270001 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

Aug. 08, 2013

Device having at least two wafers for detecting electromagnetic radiation and method for producing said device

Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Ingo Herrmann, Friolzheim, DE;

Karl-Franz Reinhart, Weinsberg, DE;

Tjalf Pirk, Stuttgart, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:

Maginot, Moore & Beck LLP

Primary Examiner:

Kenneth J Malkowski

Int. Cl.
CPC ...
H01L 31/09 (2006.01); G01J 5/04 (2006.01); G01J 5/20 (2006.01); H01L 23/26 (2006.01); H01L 27/146 (2006.01); B81C 1/00 (2006.01); G01J 5/00 (2006.01); H01L 31/18 (2006.01); H01L 23/10 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/09 (2013.01); B81C 1/00238 (2013.01); G01J 5/00 (2013.01); G01J 5/045 (2013.01); G01J 5/20 (2013.01); H01L 23/26 (2013.01); H01L 27/1465 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 31/18 (2013.01); B81B 2201/0207 (2013.01); B81B 2207/012 (2013.01); B81B 2207/097 (2013.01); B81C 2203/0792 (2013.01); H01L 23/10 (2013.01); H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/94 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/2745 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/94 (2013.01); H01L 2924/10252 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10335 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01);
Abstract

An arrangement of at least two wafers for detecting electromagnetic radiation, in particular far infrared radiation, comprises a first wafer and a second wafer. The first wafer includes a microsystem formed as a sensor array. The microsystem is configured to register electromagnetic radiation and provide a corresponding sensor signal. The second wafer includes an integrated circuit formed as an evaluation circuit that is coupled to the sensor array. The integrated circuit is configured to detect the electromagnetic radiation with the aid of the sensor signal provided.

Find Patent Forward Citations

Herrmann, Ingo. (2019). Device having at least two wafers for detecting electromagnetic radiation and method for producing said device (U.S. Patent No. 10270001). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10270001

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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