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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10269989 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

Feb. 27, 2018

Water-insensitive gas sensor using polymer-encapsulated pt—algan/gan diodes

Applicant:

University of Florida Research Foundation, Incorporated, Gainesville, FL (US);

Inventors:

Fan Ren, Gainesville, FL (US);

Stephen J. Pearton, Gainesville, FL (US);

Soohwan Jang, Gainesville, FL (US);

Sunwoo Jung, Suwon-si, KR;

Assignee:

University of Florida Research Foundation, Incorporated, Gainesville, FL (US);

Attorney:

Alston & Bird LLP

Primary Examiner:

Ngan V Ngo

Int. Cl.
CPC ...
G01N 27/12 (2006.01); G01N 33/00 (2006.01); H01L 21/04 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 29/20 (2006.01); H01L 29/47 (2006.01); H01L 29/66 (2006.01); G01N 27/407 (2006.01); H01L 29/205 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 29/872 (2013.01); G01N 27/129 (2013.01); G01N 27/4074 (2013.01); G01N 33/005 (2013.01); H01L 21/0495 (2013.01); H01L 23/291 (2013.01); H01L 23/293 (2013.01); H01L 23/3171 (2013.01); H01L 23/3192 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/47 (2013.01); H01L 29/475 (2013.01); H01L 29/66143 (2013.01); H01L 29/66212 (2013.01); H01L 29/66219 (2013.01);
Abstract

A hydrogen sensor can include a substrate, an Ohmic metal disposed on the substrate, a nitride layer disposed on the substrate and having a first window exposing the substrate, a Schottky metal placed in the first window and disposed on the substrate, a final metal disposed on the nitride layer and the Schottky metal and having a second window exposing the Schottky metal, and a polymethyl-methacrylate (PMMA) layer encapsulating the second window. The PMMA layer can fill the second window and be in contact with the Schottky metal.

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