The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Dec. 28, 2017
Applicant:
Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, Hubei, CN;
Inventor:
Junyan Hu, Wuhan, CN;
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/3213 (2006.01); H01L 21/027 (2006.01); H01L 29/49 (2006.01); H01L 21/02 (2006.01); H01L 29/51 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1218 (2013.01); H01L 21/0273 (2013.01); H01L 21/32139 (2013.01); H01L 27/124 (2013.01); H01L 27/1248 (2013.01); H01L 27/1262 (2013.01); H01L 27/1288 (2013.01); H01L 21/0217 (2013.01); H01L 21/28568 (2013.01); H01L 29/4908 (2013.01); H01L 29/518 (2013.01);
Abstract
A flexible array substrate and a manufacturing method thereof are provided. The array substrate includes a glass substrate, a flexible base substrate, a buffer layer, an active layer, a gate insulating layer, a first metal layer, an interlayer insulating layer, a flexible organic layer, a second metal layer and a passivation layer. The flexible organic layer includes at least two first via holes, and the first via holes sequentially pass through the interlayer insulating layer, the gate insulating layer and the buffer layer.