The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Dec. 19, 2017
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Akinori Sakakibara, Toyota, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
Abstract
The manufacturing method of a semiconductor device includes applying a conductive paste containing metal particles to a specified area in an electrode plate including a recess in a surface of the electrode plate, the specified area being adjacent to the recess. The manufacturing method of a semiconductor device includes placing a semiconductor chip on the conductive paste so that an outer peripheral edge of the semiconductor chip is located above the recess. The manufacturing method of a semiconductor device includes hardening the conductive paste by heating the conductive paste while applying pressure to the semiconductor chip in a direction toward the electrode plate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile