The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Jul. 16, 2015
Applicant:

Ultramemory Inc., Tokyo, JP;

Inventors:

Motoaki Saito, Tokyo, JP;

Takao Adachi, Tokyo, JP;

Assignee:

ULTRAMEMORY INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/822 (2006.01); H01L 27/04 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/76898 (2013.01); H01L 21/822 (2013.01); H01L 27/04 (2013.01); H01L 2223/6627 (2013.01);
Abstract

A semiconductor element that has an element first main surface, an element second main surface that is the reverse surface from the element first main surface, and an element side surface. The semiconductor element is configured from a semiconductor substrate part and an insulating layer part and is provided with: a signal transmission/reception terminal that is provided to the element first main surface and that contacts and can transmit/receive signals to/from an external-substrate signal transmission/reception terminal that is provided to an external substrate that is external to the semiconductor element; and a signal transmission/reception coil that is provided to the element side surface and that, via the element side surface, can transmit/receive signals in a non-contact manner to/from an external-semiconductor-element signal transmission/reception part that is provided to an external semiconductor element that is external to the semiconductor element. The signal transmission/reception coil has: a conductor that is formed inside the insulating layer part; and a conductor that is formed inside the semiconductor substrate part.


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