logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10269725 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

Jun. 27, 2017

Semiconductor package and method of manufacturing the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jong Woo Choi, Suwon-si, KR;

Hyun Kook Cho, Suwon-si, KR;

Hyuk Joo Yoon, Suwon-si, KR;

Hyuk Ki Kwon, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Allan R Wilson

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 21/6836 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.

Find Patent Forward Citations

Choi, Jong. (2019). Semiconductor package and method of manufacturing the same (U.S. Patent No. 10269725). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10269725

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…