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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10269667 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

May. 23, 2014

Semiconductor device packaging with reduced size and delamination

Applicant:

Melexis Technologies NV, Tessenderlo, BE;

Inventor:

Carl Van Buggenhout, Aalst, BE;

Assignee:

MELEXIS TECHNOLOGIES NV, Tessenderlo, BE;

Attorney:

Workman Nydegger

Primary Examiner:

Kimberly N Rizkallah

Assistant Examiner:

Dilinh P Nguyen

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/04 (2006.01); B81C 1/00 (2006.01); H01L 23/31 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/041 (2013.01); B81C 1/00269 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 23/16 (2013.01); H01L 23/3142 (2013.01); H01L 23/3157 (2013.01); B81C 2203/0118 (2013.01); H01L 2224/16 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A packaged semiconductor device comprising a stack including a die comprising a functional circuit, and a cap which is wafer bonded to the die for protecting the functional circuit as well as a mold component for packaging the stack. At least the cap and/or the die comprises at least one groove at least partially in contact with the mold component, for increasing adhesion of the mold component to the stack. A corresponding method for manufacturing such a packaged device also is described.

Find Patent Forward Citations

Van Buggenhout, Carl. (2019). Semiconductor device packaging with reduced size and delamination (U.S. Patent No. 10269667). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10269667

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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