The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Sep. 06, 2017
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventor:

Kazuhiro Segawa, Kuwana, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); H01L 21/67288 (2013.01);
Abstract

According to an embodiment, a manufacturing system for a semiconductor device includes a first processing device and a second processing device, a measurement section, and an analysis section. The first processing device and the second processing device are adapted to perform a film formation process on a substrate in a wafer. The measurement section is adapted to measure a first value related to a shape of the wafer after film formation by the first processing device, and then measure a second value related to a distortion of the wafer based on the first value. The analysis section is adapted to change a film formation condition of the second processing device based on processing information of the first processing device, the second value, and information of the second processing device.


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