The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Dec. 21, 2017
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Kunihiro Abe, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/768 (2006.01); H01L 29/51 (2006.01); H01L 21/683 (2006.01); H01L 21/311 (2006.01); H01L 23/31 (2006.01); H01L 21/02 (2006.01); H01L 21/78 (2006.01); H01L 21/3065 (2006.01); H01L 27/146 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/0212 (2013.01); H01L 21/02271 (2013.01); H01L 21/30655 (2013.01); H01L 21/31116 (2013.01); H01L 21/6836 (2013.01); H01L 21/76811 (2013.01); H01L 21/78 (2013.01); H01L 23/3185 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H01L 29/51 (2013.01); H01L 21/561 (2013.01); H01L 23/562 (2013.01);
Abstract

A semiconductor apparatus includes a semiconductor substrate having an upper surface on which a semiconductor element is disposed, a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface. The side surface has a plurality of concavities that each extend along the edge of the upper surface and that are arranged in a direction intersecting with the upper surface and the lower surface, and a plurality of ridges that are each located at the boundary between adjacent two of the plurality of concavities. The plurality of concavities and the plurality of ridges are covered with an insulating film containing carbon and fluorine.


Find Patent Forward Citations

Abe, Kunihiro. (2019). Semiconductor apparatus, method of manufacturing the same, and equipment (U.S. Patent No. 10269638). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10269638

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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