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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10269500 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

Jun. 19, 2012

Circuit module

Applicant:

Masashi Hayakawa, Nagaokakyo, JP;

Inventor:

Masashi Hayakawa, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Eric W Thomas

Assistant Examiner:

Arun Ramaswamy

Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01G 4/30 (2006.01); H01L 49/02 (2006.01); H01G 4/38 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 25/16 (2006.01); H01G 4/232 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01G 4/385 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01L 23/49822 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 25/16 (2013.01); H05K 1/162 (2013.01); H01L 2224/16225 (2013.01); H05K 3/4611 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/09672 (2013.01);
Abstract

A circuit module includes a multilayer substrate including built-in capacitors and external components mounted on the surface of the multilayer substrate. On the surface of a dielectric layer, an auxiliary electrode is provided. The auxiliary electrode is electrically connected to a capacitor electrode via a via electrode passing through the dielectric layer. On the surface of a dielectric layer, a capacitor electrode is arranged so as to face the capacitor electrode and the auxiliary electrode connected to the capacitor electrode. The auxiliary electrode is arranged in an area in which the capacitor electrodes overlap each other as viewed from a lamination direction.

Find Patent Forward Citations

Hayakawa, Masashi. (2019). Circuit module (U.S. Patent No. 10269500). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10269500

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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