The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Jul. 07, 2015
Applicants:

Sumitomo Electric Fine Polymer, Inc., Sennan-gun, Osaka, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Yuuki Yabe, Osaka, JP;

Ryohei Fujita, Osaka, JP;

Ryota Fukumoto, Osaka, JP;

Satoshi Yamasaki, Osaka, JP;

Shinya Nishikawa, Osaka, JP;

Assignees:

SUMITOMO ELECTRIC FINE POLYMER, INC., Sennan-gun, Osaka, JP;

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 13/22 (2006.01); H01B 7/282 (2006.01); B32B 7/02 (2019.01); B32B 7/12 (2006.01); B32B 1/08 (2006.01); H02G 15/04 (2006.01); C09J 123/06 (2006.01); C09J 123/08 (2006.01); C09J 177/00 (2006.01); H01B 7/00 (2006.01); H02G 3/04 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 3/20 (2006.01); B32B 7/05 (2019.01); C09J 201/00 (2006.01);
U.S. Cl.
CPC ...
H01B 13/228 (2013.01); B32B 1/08 (2013.01); B32B 3/20 (2013.01); B32B 7/02 (2013.01); B32B 7/05 (2019.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); C09J 123/06 (2013.01); C09J 123/0853 (2013.01); C09J 177/00 (2013.01); H01B 7/0009 (2013.01); H01B 7/2825 (2013.01); H02G 3/0412 (2013.01); H02G 15/04 (2013.01); B32B 2250/24 (2013.01); B32B 2250/44 (2013.01); B32B 2307/206 (2013.01); B32B 2307/70 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/732 (2013.01); B32B 2307/736 (2013.01); B32B 2597/00 (2013.01); B32B 2605/00 (2013.01); C09J 201/00 (2013.01); C09J 2203/302 (2013.01); C09J 2423/00 (2013.01); C09J 2431/00 (2013.01); C09J 2477/00 (2013.01);
Abstract

A heat-shrinkable tube or heat-shrinkable cap includes an adhesive layer disposed on the inner surface thereof, the adhesive layer including a low-viscosity adhesive layer formed of a resin having a viscosity of 10 Pa·s or less at a shear rate of 1 sat the heat shrinkage temperature and a viscosity of 100 Pa·s or more at a shear rate of 1 sat the maximum continuous use temperature. The heat-shrinkable tube or heat-shrinkable cap is used for waterproofing an exposed portion of electrical wires of an electrical wire bundle such as a wire harness, in which merely by placing the heat-shrinkable tube or heat-shrinkable cap over the exposed portion of electrical wires, waterproofing and water blocking between strands can be achieved, and outflow of the resin during heat shrinking does not occur. A method of waterproofing an electrical wire bundle uses the heat-shrinkable tube or heat-shrinkable cap.


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