The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Sep. 01, 2017
Applicant:

Midea Group Co., Ltd., Foshan, CN;

Inventors:

Dongyan Wang, San Jose, CA (US);

Haisong Gu, Cupertino, CA (US);

Tao Liu, Sunnyvale, CA (US);

Assignee:

MIDEA GROUP CO., LTD., Foshan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2017.01); B25J 9/16 (2006.01); G01N 21/88 (2006.01); G01B 11/30 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); B25J 9/1674 (2013.01); G01B 11/30 (2013.01); G01N 21/88 (2013.01); G06T 2207/30108 (2013.01);
Abstract

A method of improved quality inspection includes (i) receiving a first command to capture a first image of a surface of a product, (ii) positioning, by actuating a plurality of rotatable joints, a camera at a first position that is substantially adjacent to the surface of the product, and capturing the first image of the surface of the product. The method further includes, after capturing the first image: (i) processing the first image to identify a defect in the first image and a relative location of the defect in the first image, and (ii) determining a second position of the camera in accordance with the first position of the camera and the relative location of the defect in the first image, and (iii) repositioning, by actuating the plurality of rotatable joints, the camera from the first position to the second position. The method further includes capturing the second image.


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