The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Aug. 04, 2015
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Adam C. Wood, Oro Valley, AZ (US);
Charles J. Bersbach, Tucson, AZ (US);
Assignee:
Raytheon Company, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 13/00 (2006.01); F42B 15/34 (2006.01); F03G 7/06 (2006.01); H05K 7/20 (2006.01); H05K 7/14 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); F28F 21/02 (2006.01);
U.S. Cl.
CPC ...
F28F 13/00 (2013.01); F03G 7/065 (2013.01); F42B 15/34 (2013.01); H05K 7/20445 (2013.01); F28F 21/02 (2013.01); F28F 2013/006 (2013.01); F28F 2013/008 (2013.01); F28F 2255/04 (2013.01); H01L 23/3737 (2013.01); H01L 23/433 (2013.01); H05K 7/1434 (2013.01);
Abstract
A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.