The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Mar. 30, 2016
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Peng Wang, San Diego, CA (US);
Unnikrishnan Vadakkanmaruveedu, Chandler, AZ (US);
Vinay Mitter, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); F25B 21/04 (2006.01); H01L 23/38 (2006.01); H01L 35/30 (2006.01); H01L 35/32 (2006.01);
U.S. Cl.
CPC ...
F25B 21/04 (2013.01); G06F 1/20 (2013.01); G06F 1/203 (2013.01); H01L 23/38 (2013.01); H01L 35/30 (2013.01); H01L 35/32 (2013.01);
Abstract
An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.