The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

Nov. 11, 2015
Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Hirotsugu Kawanaka, Tokyo, JP;

Ittou Sugimoto, Tokyo, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F02F 3/12 (2006.01); C23C 24/08 (2006.01); B22F 5/00 (2006.01); B22F 7/00 (2006.01); B22F 7/08 (2006.01); B23K 20/02 (2006.01); C23C 24/00 (2006.01); C23C 26/00 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); F02F 3/14 (2006.01); F01L 3/04 (2006.01); F02B 77/02 (2006.01); F02B 77/11 (2006.01);
U.S. Cl.
CPC ...
F02F 3/12 (2013.01); B22F 5/008 (2013.01); B22F 7/004 (2013.01); B22F 7/08 (2013.01); B23K 20/02 (2013.01); C23C 24/00 (2013.01); C23C 24/08 (2013.01); C23C 24/085 (2013.01); C23C 24/087 (2013.01); C23C 26/00 (2013.01); C23C 28/00 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 30/00 (2013.01); F01L 3/04 (2013.01); F02B 77/02 (2013.01); F02B 77/11 (2013.01); F02F 3/14 (2013.01); B22F 2999/00 (2013.01); F01L 2101/00 (2013.01); F01L 2101/02 (2013.01); F01L 2103/00 (2013.01); F01L 2820/01 (2013.01); F02F 2200/00 (2013.01);
Abstract

Provided are a heat-resistant member provided with a heat-shielding coating suitable for stable manufacturing and excellent in heat-insulating, thermoresponsive and distortion accommodating properties, and a method for manufacturing the same. The heat-shielding coating includes a metallic portion formed of agglomerates of a plurality of metal particles, and inorganic compound particles dispersed in the metallic portion. The metal particles are diffusion-bonded each other, and the metallic portion and a base material of the heat-resistant member are diffusion-bonded each other. The manufacturing method includes the steps of depositing mixed particles of the metal particles and the inorganic compound particles on a surface of the base material in a film shape; resistance-heating the mixed particles by current-passing while pressurized in a thickness direction; diffusion-bonding the metal particles each other; and the metallic portion and the base material each other.


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