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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10266733 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

Feb. 07, 2017

Optically clear hot melt adhesives and uses thereof

Applicants:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Yuxia Liu, Dayton, NJ (US);

Charles W. Paul, Morristown, NJ (US);

Peter D. Palasz, Maidenhead, GB;

Assignees:

HENKEL IP & HOLDING GMBH, Duesseldorf, DE;

HENKEL AG & CO. KGAA, Duesseldorf, DE;

Attorney:

Sun Hee Lehmann

Primary Examiner:

Ruiyun Zhang

Int. Cl.
CPC ...
C09J 153/02 (2006.01); B32B 7/06 (2019.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01); B32B 37/00 (2006.01); B32B 37/12 (2006.01); C09J 4/06 (2006.01); B32B 7/12 (2006.01); C09J 5/00 (2006.01); C08L 9/00 (2006.01);
U.S. Cl.
CPC ...
C09J 153/025 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/20 (2013.01); B32B 27/30 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); B32B 37/003 (2013.01); B32B 37/12 (2013.01); C08L 9/00 (2013.01); C09J 4/06 (2013.01); C09J 5/00 (2013.01); B32B 2037/1253 (2013.01); B32B 2037/1269 (2013.01); B32B 2264/10 (2013.01); B32B 2264/101 (2013.01); B32B 2264/102 (2013.01); B32B 2264/105 (2013.01); B32B 2264/108 (2013.01); B32B 2270/00 (2013.01); B32B 2307/412 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7246 (2013.01); B32B 2309/02 (2013.01); B32B 2309/12 (2013.01); B32B 2309/68 (2013.01); B32B 2325/00 (2013.01); B32B 2333/08 (2013.01); B32B 2457/00 (2013.01); B32B 2457/12 (2013.01); B32B 2457/20 (2013.01); B32B 2457/202 (2013.01); B32B 2457/206 (2013.01); B32B 2457/208 (2013.01); C09J 2453/00 (2013.01); Y02P 20/582 (2015.11);
Abstract

Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

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