The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 23, 2019

Filed:

May. 19, 2015
Applicant:

Allnex Belgium S.a., Drogenbos, BE;

Inventors:

Michel Tielemans, Wemmel, BE;

Jean-Yves Salviato, Les Bons Villers, BE;

Jean-Noel Baurant, Dilbeek, BE;

Assignee:

ALLNEX BELGIUM S.A., Drogenbos, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/73 (2006.01); C09D 175/00 (2006.01); C09D 175/16 (2006.01); C08G 18/67 (2006.01); C08G 18/81 (2006.01); C08G 18/08 (2006.01); C08G 18/22 (2006.01);
U.S. Cl.
CPC ...
C09D 175/16 (2013.01); C08G 18/0823 (2013.01); C08G 18/227 (2013.01); C08G 18/673 (2013.01); C08G 18/73 (2013.01); C08G 18/8175 (2013.01);
Abstract

An aqueous radiation curable composition containing at least one ethylenically unsaturated polyurethane (A) and at least one ethylenically unsaturated polyurethane (B), different from the polyurethane (A), said ethylenically unsaturated polyurethane (B) preferably being characterized by a molecular weight that is below 10,000 Daltons; and optionally, at least one ethylenically unsaturated compound (C) different from (A) and (B); wherein the radiation curable composition in dry form has a steady-state creep viscosity η, expressed as the apparent viscosity after a deformation time of 30 minutes with a load σO=50 Pa at 23° C., that is above 1·10Pa·s, more preferably above 1·10Pa·s. The compositions are characterized by an improved creep viscosity ηand provide polymer materials with a good flow and mirror effect. In general, these materials are less sensitive to dust pick-up and fingerprints. Further provided is a one-vessel solvent free process for preparing such materials.


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