The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Dec. 08, 2016
Applicant:
Evonik Degussa Gmbh, Essen, DE;
Inventors:
Philipp Albert, Rheinfelden, DE;
Julia Kirberg, Rheinfelden, DE;
Jennifer Schrantz, Rheinfelden, DE;
Eckhard Just, Rheinfelden, DE;
Assignee:
Evonik Degussa GmbH, Essen, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/18 (2006.01); C09D 163/00 (2006.01); C08L 83/04 (2006.01); C08L 83/06 (2006.01); C08L 63/00 (2006.01); C08G 77/04 (2006.01); C08G 77/14 (2006.01); C08G 77/16 (2006.01); C09D 7/65 (2018.01);
U.S. Cl.
CPC ...
C08G 77/18 (2013.01); C08L 83/04 (2013.01); C08L 83/06 (2013.01); C09D 7/65 (2018.01); C09D 163/00 (2013.01); C08G 77/045 (2013.01); C08G 77/14 (2013.01); C08G 77/16 (2013.01);
Abstract
The present invention relates to a composition comprising water and a mixture of [3-(2,3-dihydroxyprop-1-oxy)propyl]silanol oligomers and ethers thereof, wherein the proportion of epoxy groups bound within Si compounds which may be present in the composition is not more than 0.05 mol of epoxy groups per mole of Si in the composition. The invention further relates to a particular process for preparing a composition according to the invention and to the use thereof.