The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Jun. 30, 2015
Applicant:
Kolon Industries, Inc., Gwacheon-si, Gyeonggi-do, KR;
Inventors:
Hee Jin Cho, Yongin-si, KR;
Do Kyung Sung, Yongin-si, KR;
Ki Hyun Park, Yongin-si, KR;
Sang Hun Park, Yongin-si, KR;
Hyun Soo Kagn, Yongin-si, KR;
Assignee:
KOLON INDUSTRIES, INC., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 61/00 (2006.01); C07D 265/14 (2006.01); C08G 61/12 (2006.01); C07D 265/12 (2006.01); C07D 413/10 (2006.01);
U.S. Cl.
CPC ...
C07D 265/14 (2013.01); C08G 61/122 (2013.01); C08G 2261/135 (2013.01); C08G 2261/1644 (2013.01); C08G 2261/60 (2013.01); C08G 2261/65 (2013.01); C08G 2261/76 (2013.01);
Abstract
Disclosed is a polybenzoxazime precursor and a method of preparing the same. The polybenzoxazime precursor is used to prepare a hardened material having improved thermal characteristics, having high thermal and flame-retardant characteristics while maintaining its excellent electrical characteristics, or having high thermal and electrical characteristics, thus being available for use in a copper clad laminate, a semiconductor encapsulate, a printed circuit board, an adhesive, a paint, and a mold.