The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Jul. 10, 2013
Shin-kobe Electric Machinery Co., Ltd., Tokyo, JP;
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Abstract
Provided herein is a molding material that attains little fluctuation in amount of short fibers and powdery resin among individual products and that allows continuous production without damaging a die. In the step of pouring, slurry is poured onto a slurry diffusion memberfrom above the slurry diffusion member. The slurry diffusion memberextends in an upward direction, and is shaped such that the area of a transverse section taken along a direction orthogonal to the upward direction becomes smaller as the slurry diffusion memberextends in the upward direction. In the step of cleaning, a dispersion medium that is the same as the dispersion medium used in the step of pouring or water is poured onto the slurry diffusion memberfrom above the slurry diffusion memberto cause the short fibers and the powdery resin adhering to a slurry diffusion portionof the slurry diffusion memberto fall down. After that, the dispersion medium is discharged from a cylindrical dieto accumulate the short fibers and the powdery resin in the cylindrical dieto obtain an aggregateof the short fibers and the powdery resin. Then, the aggregateis compressed.