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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10265745 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

Dec. 29, 2014

Seamless sleeve and seamless substrate

Applicant:

Illinois Tool Works Inc., Glenview, IL (US);

Inventors:

Louis M. Spoto, Hampton Falls, NH (US);

Dean J. Randazzo, Chicago, IL (US);

Matthew J. Deschner, Downers Grove, IL (US);

William A. Herring, Valparaiso, IN (US);

Shannon K. Crawford-Taylor, Merrillville, IN (US);

Suwit Sangkaratana, Crown Point, IN (US);

Paul R. Jelonek, Geneva, IL (US);

Alan J. Varacins, Burlington, WI (US);

Assignee:

ILLINOIS TOOL WORKS INC., Glenview, IL (US);

Attorney:

Levenfeld Pearlstein, LLC

Primary Examiner:

Adam Krupicka

Int. Cl.
CPC ...
B21B 27/03 (2006.01); B21B 27/00 (2006.01); B31F 1/07 (2006.01); B41N 6/00 (2006.01); B44B 5/00 (2006.01); B44B 5/02 (2006.01); B21B 27/02 (2006.01); B29C 59/02 (2006.01); B29C 59/04 (2006.01);
U.S. Cl.
CPC ...
B21B 27/005 (2013.01); B21B 27/02 (2013.01); B29C 59/026 (2013.01); B31F 1/07 (2013.01); B41N 6/00 (2013.01); B44B 5/0047 (2013.01); B44B 5/0052 (2013.01); B44B 5/026 (2013.01); B29C 59/04 (2013.01); B31F 2201/0723 (2013.01); Y10T 29/49563 (2015.01); Y10T 428/12292 (2015.01); Y10T 428/12389 (2015.01); Y10T 428/13 (2015.01); Y10T 428/131 (2015.01); Y10T 428/139 (2015.01); Y10T 428/1393 (2015.01); Y10T 428/24479 (2015.01); Y10T 428/24521 (2015.01);
Abstract

A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate.

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