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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10265724 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

Oct. 22, 2014

Imprint mold and imprint method

Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Naoko Nakata, Tokyo, JP;

Kouji Yoshida, Tokyo, JP;

Naoshi Kawamata, Tokyo, JP;

Takaharu Nagai, Tokyo, JP;

Koji Ichimura, Tokyo, JP;

Assignee:

DAI NIPPON PRINTING CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Joseph S Del Sole

Assistant Examiner:

Thu Khanh T Nguyen

Int. Cl.
CPC ...
B29C 43/58 (2006.01); B05D 3/12 (2006.01); G03F 7/00 (2006.01); B05D 3/06 (2006.01); B29C 59/02 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
B05D 3/12 (2013.01); B05D 3/067 (2013.01); B29C 59/02 (2013.01); G03F 7/0002 (2013.01); H01L 21/027 (2013.01);
Abstract

An imprint mold has a base, an uneven structure area set on a surface of the base, a measurement area set in the uneven structure area, and a measurement mark structure positioned in the measurement area, the measurement mark structure having a plurality of pattern sets each having a line/space shape. With this, a deformation occurring in a resin layer at the time of release of the resin layer from the mold is prevented, and a measurement mark can be formed with high accuracy.

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Nakata, Naoko. (2019). Imprint mold and imprint method (U.S. Patent No. 10265724). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10265724

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