The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

May. 22, 2015
Applicant:

Korea Advanced Institute of Science and Technology, Daejeon, KR;

Inventors:

Sung Jin Kim, Daejeon, KR;

Gi Hwan Kwon, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); F28F 13/10 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/0266 (2013.01); F28D 15/043 (2013.01); F28F 13/10 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); F28D 2015/0225 (2013.01); H01L 23/427 (2013.01);
Abstract

Disclosed is a flat plate pulsating heat pipe (FP-PHP) serving as a power-free high efficiency heat transfer system for small electronic devices such as mobile phones and laptop computers. The FP-PHP is manufactured using MEMS technology and configured to have a single-turn loop or a multi-turn loop, each having a single diameter channel or a dual diameter channel. Further, since a working fluid used in a flat plate pulsating heat pipe exhibits different characteristics according to the main working temperature, provided is a flat plate pulsating heat pipe which includes a working fluid having optimum efficiency in the main working temperature. In addition, the flat plate pulsating heat pipe applicable at various installation angles, of the present invention which is for achieving the above purpose, includes: a silicon lower wafer plate having a rectangular shape; a capillary tube comprising a channel which has a constant depth on the upper surface of the silicon wafer lower plate and is formed in the form of a straight line along the longitudinal direction of the silicon wafer lower plate, wherein the channel forms a closed loop which is bent at both ends of the silicon wafer lower plate and is connected; a wafer upper plate which is coupled on top of the silicon wafer lower plate and seals the capillary tube; and a working fluid filled inside the capillary tube, wherein the capillary tube is made of a combination of a dual-diameter tube including a pair of channels having different widths and a single diameter tube including a pair of channels having the same width.


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