The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Apr. 24, 2012
Applicants:

Jean Brun, Champagnier, FR;

Delphine Christophe, Thurins, FR;

Lionel Tenchine, Coublevie, FR;

Inventors:

Jean Brun, Champagnier, FR;

Delphine Christophe, Thurins, FR;

Lionel Tenchine, Coublevie, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 19/00 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H01L 23/498 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/00 (2013.01); F21V 19/004 (2013.01); H01L 23/49811 (2013.01); H05K 1/038 (2013.01); H05K 1/189 (2013.01); H01L 2924/0002 (2013.01); H05K 1/028 (2013.01); H05K 1/0393 (2013.01); H05K 3/30 (2013.01); H05K 3/32 (2013.01); H05K 3/321 (2013.01); H05K 2201/0129 (2013.01); H05K 2203/0278 (2013.01); Y10T 29/49117 (2015.01);
Abstract

The method for assembling a microelectronic chip device () in a fabric () comprises the following steps: providing a microelectronic chip device () comprising a base () and a protruding element () rising from a face of the base (), said protruding element () comprising a free end opposite the base (); inserting into the fabric () the chip device () by the free end of the protruding element; deforming the protruding element () at its free end so as to ensure the securing of the chip device () with the fabric () by forming a crimping bead ().


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