The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Jul. 09, 2015
Applicant:

Brillnics Inc., Grand Cayman, KY;

Inventors:

Isao Takayanagi, Tokyo, JP;

Shunsuke Tanaka, Tokyo, JP;

Kazuya Mori, Tokyo, JP;

Katsuhiko Ariyoshi, Tokyo, JP;

Shinichiro Matsuo, Tokyo, JP;

Assignee:

BRILLNICS INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/378 (2011.01); H01L 27/146 (2006.01); H01L 27/148 (2006.01); H04N 5/374 (2011.01); H04N 5/372 (2011.01); H04N 5/369 (2011.01);
U.S. Cl.
CPC ...
H04N 5/378 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/1485 (2013.01); H01L 27/14623 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/14689 (2013.01); H01L 27/14812 (2013.01); H01L 27/14818 (2013.01); H01L 27/14887 (2013.01); H04N 5/372 (2013.01); H04N 5/374 (2013.01); H04N 5/379 (2018.08);
Abstract

A solid state imaging device has: a photosensitive part containing a plurality of charge transfer parts that transfer, in column units, the signal charges of a plurality of photoelectric conversion elements disposed in a matrix; a conversion/output unit that converts, to an electrical signal, the signal charges forwarded by the charge transfer parts; a peripheral circuit part that performs a predetermined process with respect to the electrical signals from the conversion/output part; a relay part that relays the forwarding to the peripheral circuit part of the electrical signal from the conversion/output part; a first substrate where a photosensitive part and the conversion/output part are formed; and a second substrate where the peripheral circuit part is formed. The first and second substrates are stacked together, and the relay part electrically connects the conversion/output part formed at the first substrate to the peripheral circuit part formed at the second substrate.


Find Patent Forward Citations

Loading…