The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Nov. 18, 2014
Applicant:
Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;
Inventors:
Masashi Hayashiguchi, Kyoto, JP;
Kazuhide Ino, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H02H 3/00 (2006.01); H03K 17/081 (2006.01); H03K 17/082 (2006.01); H03K 17/12 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); G01R 19/00 (2006.01); H02H 3/20 (2006.01); H02H 9/04 (2006.01); H02M 7/5387 (2007.01); H02M 1/00 (2006.01);
U.S. Cl.
CPC ...
H03K 17/08104 (2013.01); G01R 19/0092 (2013.01); H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 24/40 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H02H 3/202 (2013.01); H02H 9/046 (2013.01); H02M 7/5387 (2013.01); H03K 17/0822 (2013.01); H03K 17/122 (2013.01); H01L 24/33 (2013.01); H01L 24/37 (2013.01); H01L 24/48 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/371 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H02M 2001/0009 (2013.01); H03K 2217/0027 (2013.01); Y02B 70/1483 (2013.01);
Abstract
A switching deviceincludes a SiC semiconductor chipwhich has a gate pad, a source padand a drain padand in which on-off control is performed between the source and the drain by applying a drive voltage between the gate and the source in a state where a potential difference is applied between the source and the drain, a sense source terminalelectrically connected to the source padfor applying the drive voltage, and an external resistance (source wire) that is interposed in a current path between the sense source terminaland the source pad, is separated from sense source terminal, and has a predetermined size.