IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10263594 B1

PDFFull Text
Date of Patent:
Apr. 16, 2019

Filed:

May. 23, 2017

Impedance matching circuit for radio-frequency amplifier

Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Aleksey A. Lyalin, Thousand Oaks, CA (US);

Weimin Sun, Santa Rosa Valley, CA (US);

Nicholas Quinn Muhlmeyer, North Hills, CA (US);

Russ Alan Reisner, Newbury Park, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:

Chang & Hale LLP

Primary Examiner:

Steven J Mottola

Assistant Examiner:

Hafizur Rahman

Int. Cl.
CPC ...
H03F 3/191 (2006.01); H03H 7/38 (2006.01); H01F 27/28 (2006.01); H01F 41/02 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H01L 23/66 (2006.01); H03H 7/01 (2006.01); H03H 1/00 (2006.01); H01F 30/02 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H03H 7/38 (2013.01); H01F 27/2804 (2013.01); H01F 41/02 (2013.01); H01L 23/66 (2013.01); H03F 1/565 (2013.01); H03F 3/191 (2013.01); H03F 3/195 (2013.01); H01F 30/02 (2013.01); H01F 2027/2809 (2013.01); H01L 28/10 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/49171 (2013.01); H03F 2200/387 (2013.01); H03F 2200/391 (2013.01); H03H 7/175 (2013.01); H03H 7/1758 (2013.01); H03H 7/1775 (2013.01); H03H 2001/0064 (2013.01); H03H 2001/0078 (2013.01); Y10T 29/4902 (2015.01);
Abstract

Impedance matching circuit for radio-frequency amplifier. In some embodiments, an impedance matching circuit can include a primary metal trace having a first end configured to be capable of being coupled to a voltage source for the power amplifier, and a second end configured to be capable of being coupled to an output of the power amplifier. The impedance matching circuit can further include a secondary metal trace having first end coupled to the second end of the primary metal trace, and a second end configured to be capable of being coupled to an output node. The impedance matching circuit can further include a capacitance implemented between the first and second ends of the secondary metal trace, and be configured to trap a harmonic associated with an amplified signal at the output of the power amplifier.

Find Patent Forward Citations

Loading…