The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Jan. 10, 2017
Applicants:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Sumitomo Electric Fine Polymer, Inc., Sennan-gun, Osaka, JP;

Inventors:

Ryota Fukumoto, Osaka, JP;

Satoshi Yamasaki, Osaka, JP;

Shinya Nishikawa, Osaka, JP;

Yuuki Yabe, Osaka, JP;

Assignees:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;

SUMITOMO ELECTRIC FINE POLYMER, INC., Sennan-gun, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/00 (2006.01); H02G 15/04 (2006.01); B32B 7/02 (2019.01); B32B 1/08 (2006.01); H01B 7/282 (2006.01); H01R 4/02 (2006.01); H01R 4/72 (2006.01); H01B 13/32 (2006.01); H01R 4/22 (2006.01); H02G 15/18 (2006.01);
U.S. Cl.
CPC ...
H02G 15/043 (2013.01); B32B 1/08 (2013.01); B32B 7/02 (2013.01); H01B 7/282 (2013.01); H01B 13/32 (2013.01); H01R 4/02 (2013.01); H01R 4/22 (2013.01); H01R 4/72 (2013.01); H02G 15/1813 (2013.01); H01R 2201/26 (2013.01); Y02A 30/14 (2018.01);
Abstract

A heat-recoverable component includes a tube-shaped or cap-shaped base material layer having heat shrinkability, and an adhesive layer formed on an inner circumferential surface of the base material layer. The adhesive layer includes a low-viscosity adhesive portion and a high-viscosity adhesive portion disposed between the low-viscosity adhesive portion and an opening of the base material layer. The low-viscosity adhesive portion has a shear viscosity of 10 Pa·s or less at a shear rate of 1 sat a heat shrinkage temperature of the base material layer. The high-viscosity adhesive portion has a shear viscosity of 100 Pa·s or more at a shear rate of 1 sat the heat shrinkage temperature of the base material layer. At the heat shrinkage temperature, a ratio of the shear viscosity of the high-viscosity adhesive portion to the shear viscosity of the low-viscosity adhesive portion is 15,000 or less.


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