The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Jun. 08, 2018
Applicant:

Fanuc Corporation, Yamanashi, JP;

Inventors:

Hiroshi Takigawa, Yamanashi, JP;

Hiroyuki Yoshida, Yamanashi, JP;

Assignee:

FANUC CORPORATION, Yamanashi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/024 (2006.01); H01S 5/06 (2006.01); H01S 5/40 (2006.01); H01S 5/42 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02423 (2013.01); H01S 5/02407 (2013.01); H01S 5/0612 (2013.01); H01S 5/405 (2013.01); H01S 5/4025 (2013.01); H01S 5/42 (2013.01);
Abstract

An LD module cooling device includes, in a cooling plate, common flow paths that supply/drain a cooling medium in parallel to/from a plurality of cooling portion flow paths that correspond to a plurality of LD modules, in which the cooling portion flow path is a thin layer flow path having a flow path height and a flow path width that are constant in at least a majority of a flow path length, a rectangular shape of the cooling portion flow path defined by the dimensions flow path length×flow path width overlaps with at least the majority of a main contact surface between the cooling plate and the LD modules as viewed from a front surface of the cooling plate, the flow path height of the cooling portion flow path satisfies at least either one of a condition that flow path height is 1/20 or less of the flow path length and the flow path width, and a condition that the flow path height is 0.5 mm or less, and pressure loss of a cooling medium in the cooling portion flow path is greater than pressure loss of a cooling medium in the common flow paths.


Find Patent Forward Citations

Takigawa, Hiroshi. (2019). Ld module cooling device and laser apparatus (U.S. Patent No. 10263388). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10263388

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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